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Aquasurf® Embedded Tubed Cold Plates

Aquasurf® Embedded Tubed Cold Plates

Aquasurf® Embedded Tubed Cold Plates
Technologies Benefits Applications

Technologies

Aquasurf® Embedded Tubed Cold Plates

Aquasurf® Embedded Tubed Cold Plates - Illustration 4

Aquasurf technology offers low to medium performance requirements at cost effective solutions. Flexibility in design, customized tube patterns, two-sided cooling options on tube material (copper, aluminum and stainless steel) are all part of the many advantages of the Aquasurf line of cold plates. Copper, aluminum or stainless steel tubes are embedded in the surface of an aluminum plate to provide the lowest thermal resistance between the semiconductor mounting surface and the cooling liquid. Tubes can be bent into complex arrays to ensure the cooling surface is directly under the semiconductor chips.

 

 

Aquasurf® Embedded Tubed Cold Plates - Illustration 1

 

Aquasurf® Embedded Tubed Cold Plates - Illustration 2

 

Aquasurf® Embedded Tubed Cold Plates - Illustration 3

 

 


 

Weniger

Aquasurf® Embedded Tubed Cold Plates

Aquasurf® Embedded Tubed Cold Plates - Illustration 4

Aquasurf technology offers low to medium performance requirements at cost effective solutions. Flexibility in design, customized tube patterns, two-sided cooling options on tube material (copper, aluminum and stainless steel) are all part of the many advantages of the Aquasurf line of cold plates. Copper, aluminum or stainless steel tubes are embedded in the surface of an aluminum plate to provide the lowest thermal resistance between the semiconductor mounting surface and the cooling liquid. Tubes can be bent into complex arrays to ensure the cooling surface is directly under the semiconductor chips.

 

 

Aquasurf® Embedded Tubed Cold Plates - Illustration 1

 

Mehr

Benefits

  • Cost-effective design
  • Lower weight than all-copper solution
  • Flexibility in the tube layout and configurations
  • Aluminum, copper and stainless steel available
  • Tubes mounted flush with surface to minimize
  • Thermal resistance to cooling fluid
  • Two-sided cooling

Applications

  • Inverters
  • Transportation
  • Data Centers
  • EV/HEV
  • Alternate Energy